Motivation
In the fabrication of edge-emitting lasers, it is necessary to cleave the edges of the devices along the crystal planes to create the mirrors of the laser cavity. Furthermore, it may be desired to break the arrays/bars of devices into individual devices.
Instructions and Notes
Note: This is still a work in progress. Please consult the manual and machine super-user.
- Prepare the samples by adhering them to the blue tape affixed to the mounting hoop fixture. Ensure that the entire area of the samples adheres to the tape (DXE Wafer Expander may be applicable, see links below)
- Turn on the flow of gas/vacuum using the valves
- Power on the Scriber, computer, and the monitors
- Once Windows 3.1.1 boots, the program should autostart (assuming the machine is powered on by the time the system boots). If it does not start, ensure the Scriber is powered on and then click the program icon
- In the menu bar, press Setup
- Enter General tab
- Set Mode to Scribe & Break
- Set Geometry to Circular
- Set Wafer Thickness to the sample thickness
- Set Index Length to desired distance between scribe lines, if appropriate (ie for making multiple equally spaced breaks)
- Enter Scribe Parameters tab
- Set Method to Edge
- Enter Break Parameters tab
- Set Anvil Height to Wafer Thickness + Tape Thickness + Clearance Height, where Tape Thickness is ~3mil (75um) and Clearance Height of ~1mil (25) is generally appropriate, so Wafer Thickness + 100um
- Set Anvil Gap to Wafer Thickness + Tape Thickness - Compression, suggest using Anvil Height + 100um
- Set Pressure (to be determined in process development)
- Press Exit, and save. If there are any errors, read and change values accordingly
- Mount the hoop with the samples on the DX-III Vacuum Hoop
- Press Interactive Mode. If the vacuum does not appear to seal, you may need to press the ring down slightly to form a seal
- Align the cross-hairs on screen to a cleave plane on the sample using the controls on the right and press Accept Theta Alignment
- Scribing
- Align the vertical to the height of the desired scribe line
- Move the horizontal so that the scribe (upon extension) will hit the right-most point of the desired scribe line
- Press Single Scribe. The scribe should extend and touch the sample, calibrating the device. If this fails, you may need to increase the Scribe Force in the Setup menu, Scribe Parameters tab, and try again
- Press Single Scribe. The device should start scribing the sample, potentially repetitively. If the scribe moves off device and moves way off left, pause and cancel the scribing
- Repeat for all desired scribe points. Use index arrow buttons to move by the desired inter-scribe distance
- Breaking
- Align vertical to first scribe line
- Press Single Break. The device should calibrate itself in anticipation of a break
- Press single break. The device should slam the sample into the anvil and break/cleave the sample. If it fails to do so, you may need to lower the Anvil Height or Anvil Gap in the Setup menu, Break Parameters tab, and try again
- Repeat for all scribes. Use index arrow buttons to move by the desired inter-scribe distance
- Once finished, press Unload Wafer and wait for the machine to finish
- Remove the hoop fixture with samples
- Quit the program by clicking File->Exit
- Exit (shut down) Windows by clicking File->Exit Windows, and click OK
- Once the computer is off and the hard drive stops, power off the computer
- Power off the monitors and machine
- Shut off gas and vacuum using the valves
- Remove samples from tape (DXE Wafer Expander may be applicable, see links below)
Links
DXE Wafer Expander
- DXE 5 Series Wafer Expander
- How to use the DXE Wafer Expander - YouTube
- DXE 5 Series Wafer Expander Data Sheet
Dynatex International DX-III Scriber-Breaker
- Dynatex DX-III Scriber-Breaker - YouTube
- Dynatex DX-III Scriber\Breaker #53537 - YouTube
- Article on machine